Heat Sinks

High performance thermal managment

Heat sinks are heat exchangers that transfer the heat away from a device (electronic or mechanical). The heat sink allows a good temperature management.
cern collimators heat sinks

The best range of advanced materials for applications such as Power Electronics, Brake Components, Aerospace and Scientific Installations.

Copper Diamond - Diamond/copper composite material

Nanostructured Aluminum nitride/boron nitride (AlN/BN) composite

Molybdenum Graphite

Advantages

Graphite-based composite

A step-forward on lightweight heat sink materials​

In-plane thermal conductivity 800 W/mK

Two times higher than copper​

Lightweight (low dense material – 2.60 g/cm3)

Same range as aluminium

CTE close to PE (power electronics) modules

In-plane value in the range 4·10-6ºC-1

Block sizes up to 200x200x30 mm available

Possibility to produce custom-made parts

High strength

Strength values up to 200 Mpa, doubling the values of isostatic graphites

KTM650-Technical-Data-Sheet-0221-1.pdf - Google Chrome 11_03_2021 10_23_42 (2)
TDS – Technical Data Sheet (Graphite-Mo KTM650)

Boron Nitride Composite

Boron Nitride Composite

KBNC - Technical Data Sheet - 0221.pdf (PROTEGIDO) - Adobe Acrobat Reader DC (32-bit) 11_03_2021 10_09_19
TDS – Technical Data Sheet (Boron Nitride Composite KBNC)
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