Heat Sinks
High performance thermal managment
Heat sinks are heat exchangers that transfer the heat away from a device (electronic or mechanical). The heat sink allows a good temperature management.
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The best range of advanced materials for applications such as Power Electronics, Brake Components, Aerospace and Scientific Installations.
Copper Diamond - Diamond/copper composite material
- Thermal conductivity (TC) higher than copper and two to three times higher than AlN or CuW
- Coefficient of Thermal Expansion (CTE) of 6, similar to Gallium Arsenide (GaAs)
- Manufacture with SPS Technology
Nanostructured Aluminum nitride/boron nitride (AlN/BN) composite
- High thermal conductivity combined with optical transparency over a wide spectral range
- Excellent dielectric properties
- High mechanical strength
Molybdenum Graphite
Advantages
Graphite-based composite
A step-forward on lightweight heat sink materials
In-plane thermal conductivity 800 W/mK
Two times higher than copper
Lightweight (low dense material – 2.60 g/cm3)
Same range as aluminium
CTE close to PE (power electronics) modules
In-plane value in the range 4·10-6ºC-1
Block sizes up to 200x200x30 mm available
Possibility to produce custom-made parts
High strength
Strength values up to 200 Mpa, doubling the values of isostatic graphites
Boron Nitride Composite
Boron Nitride Composite
- High Resistance to Thermal Shock
- Good Machinability
- High Electrical Insulation
- Good Corrosion and Wear Resistance
- Non-Wetted by Non Ferrous Molten Metals & Glass
