High Performance

Heat-sinks

Heat sinks are heat exchangers that transfer the heat away from a device (electronic or mechanical). The heat sink allows a good temperature management.
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cern collimators heat sinks

The best range of advanced materials for applications such as Power Electronics, Brake Components, Aerospace and Scientific Installations.

Molybdenum Graphite

Copper Diamond - Diamond/copper composite material

  • Thermal conductivity (TC) higher than copper and two to three times higher than AlN or CuW
  • Coefficient of Thermal Expansion (CTE) of 6, similar to Gallium Arsenide (GaAs)
  • Manufacture with SPS Technology

Nanostructured Aluminum nitride/boron nitride (AlN/BN) composite

  • High thermal conductivity combined with optical transparency over a wide spectral range
  • Excellent dielectric properties
  • High mechanical strength

Advantages

Graphite-based composite

A step-forward on lightweight heat sink materials​

In-plane thermal conductivity 700 W/mK

Two times higher than copper​

Lightweight (low dense material – 2.60 g/cm3)

Same range as aluminium

CTE close to PE (power electronics) modules

In-plane value in the range 4·10-6ºC-1

Block sizes up to 200x200x30 mm available

Possibility to produce custom-made parts

High strength

Strength values up to 200 Mpa, doubling the values of isostatic graphites

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